Memory with expandable row width

ABSTRACT

A method for operating a memory device includes initiating an access operation to a corresponding row of an array of bit cells of the memory device. Responsive to an expansion mode signal having a first state, the method further includes dynamically operating each column of a plurality of columns of the array to access each bit cell of a corresponding row within the plurality of columns during the access operation. Alternatively, responsive to the expansion mode state signal having a second state different than the first state, the method includes dynamically operating each column of a first subset of columns of the plurality of columns to access each bit cell of a corresponding row within the first subset of columns during the access operation, and maintaining each column of a second subset of columns of the plurality of columns in a static state during the access operation.

BACKGROUND

Static random access memory (SRAM) and other types of memory typicallyare implemented as one or more arrays of bit cells, with the bit cellsof each array arranged in rows and columns. The bit cells of a row in anarray typically are configured to store a block of data (e.g., a word ofdata or double-word of data) and error correcting code (ECC), parity,status information or other metadata associated with that block of data,such that a certain number of bit cell columns in that row are used forstoring corresponding bits of the data block, while other bit cellcolumns in that row are used for storing the corresponding bits of themetadata for that data block.

A device provider or supplier may intend a particularmemory-implementing device to be implementable in a variety of differentsystem configurations. However, these different system configurationsmay have different requirements regarding one or both of the size ofdata blocks stored at the memory or the type or amount of metadatastored with each data block. To illustrate, one system configuration maybe designed for a 96-bit data block, whereas another systemconfiguration may be designed for a 128-bit data block. As anotherexample, one system configuration may utilize ECC, whereas anothersystem configuration may not incorporate ECC into its operations. Often,such memory configuration variations lead to the design and provision ofseparate memory designs for each expected implementation, or even to thedesign and provision of separate system on a chip (SoC) designs for eachexpected SoC implementation. However, developing different variations ofthe same basic memory design to accommodate different data widths ormetadata capabilities is resource-intensive and thus oftenimpracticable.

To avoid the need to have multiple design variations for differentconfigurations or markets, some conventional memory designs include themaximum number of bit cell columns needed to support the largest datablock/metadata use case, and then employ masks that effectively mask offthe values of bits read from bit cell columns not used for a particularconfiguration that requires a narrower data block or fewer bits ofmetadata. To illustrate, a memory design may have 128 bit cell columnsto support a 128-bit data block, but for those design configurationsusing, for example, only 96 bits per data block, the memory used in suchdesign configurations would employ a mask to mask the read output of theunused 32 columns of bit cells. However, while providing designflexibility, such masks only mask off whatever values are read from suchbit cells, and do not effectively disable the unused bit cells. As such,the bit cells in masked-off columns remain active and thus consumeconsiderable dynamic power during memory access operations.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure may be better understood, and its numerousfeatures and advantages made apparent to those skilled in the art byreferencing the accompanying drawings. The use of the same referencesymbols in different drawings indicates similar or identical items.

FIG. 1 is a block diagram illustrating a memory device employing a bitcell array with an expandable column width in accordance with someembodiments.

FIG. 2 is a block diagram illustrating an expansion bit cell column ofthe memory device of FIG. 1 in accordance with some embodiments.

FIG. 3 is a flow diagram illustrating a method of operation of thememory device of FIG. 1 in accordance with some embodiments.

FIG. 4 is a diagram illustrating a low dynamic power consumptionoperation of a bit cell of a disabled expansion bit cell column inaccordance with some embodiments.

FIG. 5 is a diagram illustrating an implementation of a write columnselect control circuit in accordance with some embodiments.

FIG. 6 is a diagram illustrating an implementation of a bit lineprecharge control circuit in accordance with some embodiments.

FIG. 7 is a diagram illustrating an implementation of a sense amplifierenable control circuit in accordance with some embodiments.

FIG. 8 is a diagram illustrating an implementation of a write driver anda write driver control circuit in accordance with some embodiments.

DETAILED DESCRIPTION

Providing a single memory design that accommodates different data blockwidths or different metadata usages results in columns of bit cells ofan array being unutilized for implementations that require less than themaximum data block width or less than the maximum metadata usageprovided by a memory design. Disclosed herein are systems and techniquesfor reducing or eliminating the power consumption of such unutilized bitcell columns while facilitating the memory design to be usable in avariety of implementations. In at least one embodiment, a memory deviceincludes an array of bit cells and corresponding access components usedto access the array of bit cells during access operations. The array ofbit cells is arranged into a plurality of rows and a plurality ofcolumns. The plurality of columns has a first subset of columns thatacts as the default, or minimum, data block width and/or metadata“width” for the memory device. The plurality of columns further includesone or more additional second subsets of columns, each second subset ofcolumns acting as an “expansion” data set that may be used to expand thedata block width and/or metadata width for a given implementation. TheSoC or other implementing such a memory design thus may be operated inone of a plurality of modes, including a default mode in which none ofthe expansion data sets are activated for dynamic operation, or one ormore expansion modes in which one or more expansion data sets areactivated for dynamic operation (that is, to store valid bits andprovide access thereto).

When an expansion data set is activated for dynamic operation throughactivation of a corresponding expansion mode, the memory-implementingdevice operates the second subset of bit cell columns associated withthat expansion data set in a conventional manner (that is, in the samemanner as the first set of bit cell columns) such that the bit cells ofthe second subset of bit cell columns may be accessed for read and writememory access operations as is known in the art. However, when anexpansion data set is disabled through deactivation of the correspondingexpansion mode, the access components of the memory device operate so asto hold the bit cells of the corresponding second subset of bit cellcolumns in a static state during memory accesses to corresponding rowsof the array. These bit cell columns may be configured or otherwise heldin a static state through control of the signaling provided to thesecolumns and through control of the access components used to accessthese columns. Examples of such include, but are not limited to,disabling precharging of the bit lines for the columns of the secondsubset, configuring the write drivers to drive a specified oppositelogic value pair on the bit lines of the bit line pairs, disabling thesense amplifiers, and the like. By maintaining the bit cell columns in astatic state for an unused expansion data set, the bit cells of thesebit columns and the circuitry of the memory device used to access thesebit cells are configured to draw relatively little dynamic power. Thisallows the memory device or SoC implementing such a memory design to beutilized in configurations that use less than the full data block widthor metadata width without paying a power consumption penalty for theunused width capacity.

FIG. 1 illustrates a memory device 100 that provides multiple row widthconfigurations with reduced power consumption in accordance with someembodiments. The memory device 100 includes an array 102 of bit cells104, wherein the bit cells 104 are arranged in N columns and M rows (N,M being integers greater than zero). For purposes of illustration, thememory device 100 is implemented as a static random access memory (SRAM)and the bit cells 104 thus are SRAM bit cells using any of a variety ofSRAM cell architectures, such as one of the six-transistor (6T) or eighttransistor (8T) bit cell architectures known in the art. Although onearray 102 is illustrated, it will be appreciated that in implementationthe memory device 100 typically would include a number of such arrays102. The memory device 100 may be implemented as, for example, part of asystem on a chip (SoC) or other larger electronic component or system.

The memory device 100 further includes access components 106 to accessand otherwise control the bit cells 104 of the array 102 during accessoperations. The access components 106 include a row select component 108(also frequently referred to as “address decode logic”), a columncontrol component 110, and a read control component 112. As a generalsummary of their operation during a read access, write access, or otheraccess operations, the row select component 108 operates to decode anaddress (“ADDR”) provided with the access operation to determine thecorresponding row of the array 102, and to activate the correspondingword line pair for that row. Concurrently, the column control component110 operates to activate the bit cells 104 of the corresponding columnby enabling bit line precharge circuitry of the column control component110 to precharge the bit line pairs. Further, if the access operation isa write operation, activating write column select (WCS) circuitry toselect the appropriate columns of the array 102 and configuring writedrivers of the column control component 110 to drive the bit lines ofeach bit line pair 116 with a pair of logic values in accordance withthe corresponding bit values of the data (“WRITE DATA”) to be written tothe accessed row. If the access operation is a read operation, then theread control component 112 enables its sense amplifiers to sense thevoltages on the bit line pairs 116 of the columns and thus sense the bitvalue store in the bit cells of the activated row, and provide thesesensed bit values as the read data (“READ DATA”) for the read operation.

In at least one embodiment, the memory device 100 is of a design that isintended to support a number of markets or implementations regarding the“width” of the rows of the array. To illustrate, in one exampleembodiment the array 102 has 156 columns, and thus has a maximum rowwidth of 156 bits. In one market, the memory device 100 may beimplemented in a system on a chip (SoC) which utilizes 128 bits of therow width for storing a 128-bit data block, and use the other 28 bitsfor ECC for the data block (one embodiment of metadata). Such animplementation would thus use the entire row width capacity. However,another SoC may utilize the memory device 100 to store 128-bit datablocks, but may not implement ECC, and thus leave the other 28 bitsunused. As another example, an SoC may utilize a 96-bit data block and28 bits of ECC, parity, and status bits (other examples of metadata) andthus leave 32 bits of the maximum row width of 156 bits unused. Whiledata masks could be used to prevent the unused bit columns from beingimproperly provided as valid data, the bit cells in these unused columnswould continue to consume considerable dynamic power during memoryaccess operations, and thus the latter two examples would pay a powerpenalty for unused row width capacity.

To more fully facilitate an adaptable or expandable design, in at leastone embodiment the memory device 100 employs a default data set and oneor more expansion data sets, with the expansion data sets configurableto reduce or eliminate dynamic power consumption when not in use for aparticular implementation. Thus, the memory device 100 may be configuredto one of multiple row width configurations without incurring a powerpenalty when using less than the full row width capacity. To this end,in at least one embodiment the memory device 100 logically divides the Ncolumns of the array 102 into a first subset of columns, referred toherein as the default subset 120 or, alternatively, the default datawidth 120, and one or more second subsets of columns, referred to hereinas the expansion subsets 122, or alternatively, expansion data sets 122.For ease of illustration, FIG. 1 depicts only a single expansion subset122, but in other embodiments multiple expansion subsets may be employedusing the guidelines and teachings provided herein. Further, for ease ofreference, bit cell columns of the array 102 that are included in thedefault data set 120 are referred to herein as “default columns”,whereas bit cell columns of the array 102 that are included in anexpansion data set 122 are referred to herein as “expansion columns.”

The default columns of the default data set 120 operate in aconventional manner regardless of the expansion mode or configuration ofthe memory device 100. As such, the number of columns in the defaultdata set 120 specify the default, or minimum, width of the rows of thearray 102. To illustrate, if it is determined that the minimum row widthto be supported by the memory device 100 is 76 bits, then the first 76columns of the M columns of the array 102 would be configured as thedefault data set 120. In contrast, the operation of the bit cell columnsof the expansion data set 122 depends on whether the expansion mode isenabled or disabled. When the expansion mode for the expansion data set122 is enabled, the columns of expansion data set 122 are operated inthe same manner as the columns of the default data set 120 such thatwhen a row of the array 102 is accessed, the bit cells along that row inboth the columns of the default data set 120 and expansion columns ofthe expansion data set 122 are read from or written to, in accordancewith the access operation. Conversely, when the expansion mode for theexpansion data set 122 is disabled, the access components 106 areconfigured to hold the expansion columns of the expansion data set 122in the same static state for each access operation so that the bit cellsand associated signaling components in the memory device 100 for theexpansion columns consume relatively little or no dynamic power duringthe access operations.

In at least one embodiment, operation of the access components 106 withrespect to the expansion columns of an expansion data set 122 isconfigured or controlled by an expansion control component 124. In theexample embodiment of FIG. 1, the expansion control component 124includes a mode set component 126, components for write driver, writecolumn select (WCS), and bit line precharge (BLPC) control (collectivelyrepresented in FIG. 1 by component 128), and a sense amplifier enable(SAEN) control component 130. Additional details regarding embodimentsof these components are described subsequently with reference to FIGS. 2and 5-8.

The mode set component 126, in one embodiment, includes an input toreceive an expansion mode program signal 132 comprising a signalindicating a mode to be implemented by the memory device 100, a storagecomponent or buffer (not shown) to store a value representing thatsignal, and one or more signal drivers to output an expansion modesignal 134 (“EXP_MODE”) for use by the other sub-components of theexpansion control component 126. To illustrate, in one embodiment, thememory device 100 is implemented as part of an SoC, and the expansionmode program signal 132 is provided by a device implementing the SoC asa voltage or logic value applied to an external pin of the SoC,whereupon the supplied signal is buffered at an I/O buffer of the SoCand the corresponding expansion mode signal 134 transmitted from thisbuffer. Alternatively, the expansion mode program signal 132 may beprovided by another component of the SoC. In other embodiments, the modeset component 126 may be implemented as, for example, aone-time-programmable (OTP) memory or other programmable storagecomponent, fuse, or anti-fuse that is set or programmed to a permanentmode upon fabrication or system integration, as a register orprogrammable logic that may be set and reset multiple times, and thelike.

The expansion mode program signal 132 and the expansion mode signal 134can be implemented in any of a variety of ways. In implementations inwhich the memory device 100 implements a single expansion data set, andthus employs only two modes: a default mode (i.e., expansion modedisabled) and an expansion activated mode, the signals 132 and 134 eachmay be implemented as a single bit/binary logic value pair, wherein onebit value/logic level indicates activation of the expansion mode, andthe other bit value/logic level indicates deactivation of the expansionmode. In the event that there are multiple expansion data sets 122 toprovide multiple expanded data width options, each expansion data set122 may be represented by a corresponding multiple bit vectorrepresenting the expansion mode signal 134. For ease of reference, theconvention used herein is as follows: a bit value of “1” for theexpansion mode signal 134 (that is, EXP_MODE=1) indicates that theexpansion mode is activated, whereas a bit value of “0” for theexpansion mode signal 134 (that is, EXP_MODE=0″ indicates that theexpansion mode is disabled. Further, as illustrated below with referenceto FIGS. 5-8, in some embodiments, the inverted complement of theexpansion mode signal 134 is used in addition to, or instead of, theexpansion mode signal 134 itself. In such instances, mode set component126 may include an inverter or other circuitry to generate the invertedcomplement of the expansion mode signal 134 (referred to herein as“EXP_MODE_B”).

FIG. 2 illustrates the expansion control component 124 in more detail inaccordance with some embodiments. In the depicted example, a generalsummary of the operation of components 128 and 130 is shown withreference to a single expansion column 200 of the expansion data set122, which has four rows, and thus four bit cells 104 (note that inimplementation, the column 200 typically would have a greater number ofrows). While only one expansion column 200 is shown, it will beappreciated that the expansion control component 124 operates in thesame manner with respect to the other expansion columns 200 of theexpansion data set 122.

Each bit cell 104 of the expansion column 200 is coupled to the bit linepair 116 associated with the column and to the word line 114 associatedwith the row in which the bit cell 104 is located. As there are fourrows in this example, there are four word lines 114, denotedWL[0]-WL[3]. The bit line pair 116 is implemented to transmit adifferential signal to the bit cells 104 of the column 200, with one bitline (“BL[0]”) carrying one voltage level or logic level, and the otherbit line (“BL_B[0]”) carrying its complement. Thus, the voltage/logicpair carried by the bit line pair 116 determines the bit value to bestored to, or written to, the bit cell of the column 200. Accordingly,during a write operation that involves the column 200 in an activatedstate, a write driver 202 outputs a corresponding pair of complementaryvoltages onto output line pair 204 that represent the bit (“WRDATA[K]”)to be written to the bit cell 104 at that row in column 200 (at positionK in the array 102), and a write column select (WCS) component 206 isconfigured to couple the output line pair 204 to the corresponding bitlines of the bit line pair 116 of the column 200, and the bit cell 104associated with the activated word line 114 is thus configured to storethe value indicated by the complementary voltage pair output by thewrite driver 202. Similarly, during a read access that includes anactivated column 200, the word line 114 associated with an address ofthe read access is activated, and bit cell 104 associated with thatactivated word line 114 configures the bit lines of the bit line pair116 to reflect the bit value stored at that bit cell 104. A senseamplifier 208 is coupled to the bit line pair 116 via a row columnselect (not shown) circuit, and outputs a bit value representing theparticular voltage pair sensed on the bit line pair 116. Further, forboth write and read accesses, the column control component 110 employs aprecharge component 210 to precharge the bit line pair 116 to facilitatethe read or write operation, as is well known in the art.

The dynamic operation of the write driver 202, the precharge component210, and the sense amplifier 208 to write to or read from the bit cells104 of the column 200 consume considerable current, and thus power.Accordingly, when the column 200 is not activated for use (that is, theexpansion mode is set to “expansion disabled” or EXP_MODE=0) theexpansion control component 124 employs various circuits to control theoperations of these memory components such that the bit cells 104 of thecolumn 200 are maintained in a substantially static state for the accessoperations occurring to the array 102 while in this mode. In particular,the expansion control component 124 includes the SAEN control component130 having an input to receive the expansion mode signal 134 (or itscomplement) and an output to provide a SAEN signal 212 based on the moderepresented by the expansion mode signal 134, whereby the SAEN signal212 is an enable signal that enables or disables the sense amplifier 208depending on its state.

The expansion control component 124 further includes a write controlcomponent 214, a WCS control component 216, and a BLPC control component218. The write control component 214 includes an input to receive theexpansion mode signal 134 (or its complement) and an output to providewrite driver configuration signal 220 based on the mode represented bythe expansion mode signal 134, whereby the write driver configurationsignal 220, when asserted, configures the write driver 202 to output aspecified logic level on both bit lines of a corresponding bit line pair116, as described below. The WCS control component 216 includes an inputto receive the expansion mode signal 134 (or its complement) and anoutput to provide WCS configuration signal 224 based on the moderepresented by the expansion mode signal 134, whereby the WCSconfiguration signal 224, when asserted, configures the WCS component206 to connect the output line pair 204 to the bit line pair 116, asdescribed below. The BLPC control component 218 includes an input toreceive the expansion mode signal 134 (or its complement) and an outputto provide a BPLC enable signal 226 based on the mode represented by theexpansion mode signal 134, whereby the BLPC enable signal 226 enables ordisables the precharge component 210 depending on its state. Further,the memory device 100 includes circuitry (represented by transistor 228)to pull the input to the write driver 202 to a known state or voltagereference (“VREF”) while in the default mode. Note that while FIG. 2depicts components 214, 216, 218, and 130 separate from the write driver202, the write column select component 206, the precharge component 210,and the sense amplifier 208, respectively, in some embodiments some orall of the components 214, 216, 218, and 130 are integrated with thecorresponding component, rather than as logic and circuitry discretefrom the corresponding component.

FIG. 3 illustrates a method 300 of operation of the memory device 100 inaccordance with some embodiments. The method 300 is described withreference to the example implementation of the expansion controlcomponent 124 and the expansion column 200 of FIG. 2. The method 300initiates at block 302 with the initialization of the memory device 100,either as a component of an SoC being initialized, or initialization asa discrete device. During initialization, an internal component orexternal device programs the memory device 100 to operate in either thedefault mode or in an expansion mode via the expansion mode programsignal 132. Accordingly, at block 304 the mode set component 126determines the state of the expansion mode program signal 132 and setsthe expansion mode signal 134 (and, in some implementations, itscomplement signal) to represent the expansion mode indicated by theexpansion mode program signal 132. As noted above, this determination ofexpansion mode is made by, for example, checking the state of anexternal pin, an OTP memory, a fuse, an anti-fuse, a register, and thelike. In the event that the indicated mode is “expansion modeactivated”, the expansion mode signal 134 is set to logic high or “1”,and otherwise set to logic low or “0”.

In the event that the expansion mode is enabled (EXP_MODE=1), then atblock 306 the expansion control component 124 configures the accesscomponents of the memory device 100 to operate in a conventional manner(that is, to permit dynamic access during access operations) withrespect to the expansion columns 200 of the expansion data set 122. Inparticular, the write control component 214 deasserts the write driverconfiguration signal 220, thereby permitting the write driver 202 todrive a voltage/logic value pair representative of the incoming bitvalue WRDATA[K] during a write access, and the write column selectcontrol component 216 deasserts the WCS configuration signal 224,thereby allowing the write column select component 206 to select theappropriate column/array based on an array select signal. Further, theBLPC control component 218 asserts the BLPC enable signal 226, therebypermitting the precharge component 210 to precharge the bit line pair116 in anticipation of a read or write access. Similarly, the SAENcontrol component 130 asserts the SAEN enable signal 212 to permitactivation of the sense amplifier 208 during read accesses. As such, thecontrol signaling and other inputs to the bit cells 104 of the expansioncolumn 200 may be dynamically operated during access operations to thearray 102, and thus permit data or metadata to be dynamically stored to,and read from, the bit cells 104 of the expansion columns 200 of theexpansion data set 122.

Returning to block 304, if the mode set component 126 instead determinesthat the expansion mode is disabled (EXP_MODE=0), then the expansioncontrol component 124 operates to maintain the bit cells 104 of theexpansion columns 200 in a substantially static state during accessoperations so as to reduce the power consumed by the expansion columns200 in their unused state. This static hold process, in one embodiment,includes the BLPC control component 218 deasserting the BLPC enablesignal 226, which in turn disables the precharge component 210, and thusprevents the precharge component 210 from precharging the bit line pair116 of the expansion column during any access operations to the array102. Further, at block 310 the SAEN control component 130 deasserts theSAEN signal 212, and thus disabling the sense amplifier 208 for theexpansion column 200. Moreover, at block 312 the WCS control component216 asserts the WCS configuration signal 224, and thereby configuringthe WCS component 206 to couple the output of the write driver 202 tothe bit line pair 116 of the expansion column 200, and at block 314 thewrite driver control component 214 asserts the write driverconfiguration signal 220 so as to configure the write driver 202 tooutput a specified opposite logic value pair on the bit lines of the bitline pair 116 regardless of the value of the EXP[0] bit input to thewrite driver 202. Note that while illustrated in a particular order inFIG. 3 for ease of discussion, the processes of blocks 308, 310, 312,314, in one embodiment, are performed in parallel, and in otherembodiments where some or all of the processes are performedsequentially, the sequence may be the same as, or different, from thatshown in FIG. 3. Also note that the process represented by blocks 308,310, 312, 314 is performed in parallel for each expansion column 200 ofthe expansion data set 122.

As represented by block 316, the combination of one or more of theprocesses of disabling precharging, disabling the sense amplifier 208,and forcing the write driver 202 to output a specified opposite logicvalue pair while in the default/non-expansion mode results in the bitcells 104 and associated access components for the expansion column 200being held in a relatively static state during access operations to thearray 102, and thus reducing or eliminating the power consumptionresulting from the otherwise dynamic operation of these components whennot in use for data storage.

FIG. 4 illustrates this aspect by way of a simplified example involvinga single bit cell 104 of the expansion column 200. In this example, thebit cell 104 is implemented as a typical 6T SRAM cell, but the describedpower-savings principles apply equally to other SRAM cell formats. Asexplained above, in an enabled expansion mode, during a write operationthe write driver 202 for the expansion column 200 is configured tooutput a specified logic value pair to the bit line pair 116, the logicvalue pair representing the logic value to be stored to the bit cell104. To illustrate, the write driver 202 could drive a logic “1” to thebit line 116-1 and the complement logic “0” to the complement bit line116-2, which in this example would represent the operation to store alogic “1” during a write operation, and drive a logic “0” and a logic“1” to the bit lines 116-1, 116-2, respectively, during a writeoperation to store a value 0.

However, as noted above, when the expansion data set 122 is disabled,the write control component 214 configures the write driver 202 tooutput a specified opposite logic value pair on the bit lines 116-1,116-2 while the expansion data set 122 is disabled. For purposes of thisexample, driving the specified opposite logic value pair includesdriving a logic “1” (or its voltage equivalent) on bit line 116-1 whiledriving a logic “0” (or its voltage equivalent) on bit line 116-2,although in other embodiments these logic values may be reversed withrespect to the bit lines 116-1, 116-2. Thus, as illustrated by view 400of FIG. 4, the first time an access operation is performed involving therow containing the bit cell 104 of FIG. 4 (at time T=0), the assertionof the write line 114 for the row and the write driver 202 driving thelogic value pair “1, 0” on bit lines 116-1, 116-2, respectively, resultsin the bit cell 104 being programmed to a logic value “1” in thisexample (as reflected by note 401). Depending on the state of the bitcell 104 during this first access operation, there may be some amount ofinrush current involved in the programming of the bit cell 104 to thelogic value “1”.

However, as reflected by view 402, for all subsequent access operationsto the row while the expansion data set 122 is enabled (e.g., at timeT=T1), when the write line 114 is activated and the write driver 202maintains the bit lines 116-1, 116-2 in the same specified “1,0”opposite logic value state as applied during the initial accessoperation, the bit cell 104 is already programmed to the logic value“1”, and thus the bit lines 116-1, 116-2, in effect, attempt to write alogic value “1” to the bit cell 104 which already stores a logic value“1”. As reflected by note 403, this operation to write the same logicvalue already stored in the bit cell 104 does not consume dynamic power,and thus maintaining this static state for the bit cell 104 by settingthe bit lines 116-1, 116-2 to maintain the same opposite logic valuepair while the expansion data set 122 is disabled avoids the inrushcurrent that otherwise would be incurred to reprogram the bit cell 104to another value.

Moreover, recall that at block 308 (FIG. 3) precharging of the bit linepair 116 is disabled, and thus avoiding the considerable current thatotherwise would be required for precharging the bit line pair 116 duringan access operation to the array 102. Similarly, as illustrated by block310 (FIG. 3), in some embodiments the sense amplifier 208 is disabled,thereby reducing or eliminating the power that otherwise would beconsumed by the sense amplifier 208 during read accesses to the array102, as well as avoiding spurious, inaccurate data outputs by the senseamplifier 208 when the expansion column 200 is not in use.

FIGS. 5-8 illustrate example circuit implementations for variouscomponents of the expansion control component 124 in accordance withsome embodiments. For purposes of comparison, these circuitimplementations also include the circuitry used to output thecorresponding control signals for a bit cell column of the default dataset 120. For naming purposes, those signals output for a bit cell columnof the default data set 120 are denoted with the suffix “_DFT”, whilethose output for an expansion column of the expansion data set 122 aredenoted with the suffix “_EXP”. Moreover, a suffix “_B” is used todenote a signal that is the inverted representation of a correspondingsignal.

FIG. 5 illustrates an example circuit implementation for the WCS controlcomponent 216 in accordance with some embodiments. In this embodiment,the WCS control component 216 includes an inverter 501 and a NAND gate502. The inverter 501 has an input to receive an inverted representationof an array select signal (identified as ARRAY_SEL_B[K]” and an outputto provide an WCS control signal (WCS_DFT[J]) to the correspondingcolumn of the default data set 120 at position Y. The NAND gate 502 hasone input to receive the signal ARRAY_SEL_B[K], an input to receive theexpansion mode signal 134 (EXP_MODE) and an output to provide the WCSconfiguration signal 224 (“WCS_CTL[K]”) for the expansion column 200 atposition X. With this configuration, whenever the expansion mode signal134 is set to “0” (that is, expansion mode disabled), then the WCSconfiguration signal 224 is asserted (that is, WSC_EXP=0), and thusconfiguring the WCS component 206 as described above. Likewise, the WCScontrol signal WCS_DFT[Y] is set to the non-inverted value of the arrayselect signal for the default columns regardless of the expansion mode(albeit with synchronized timing provided by the inverter 501).

FIG. 6 illustrates an example circuit implementation for the BLPCcontrol component 218. In this embodiment, the BLPC control component218 includes inverters 601, 602, 603, NAND gates 604, 605, and NOR gate606. The inverter 601 includes an input to receive a signal PCHG_FLTthat is asserted when the precharge circuitry is permitted to float(e.g., between access operations), and an output coupled to an input ofthe NAND gate 604. The other input of the NAND gate 604 receives aninitial precharge enable signal PCHG_EN. The output of the NAND gate 604is connected to an input of the inverter 602, and the output of theinverter 602 provides a precharge control signal BLPC_DFT[J] to theprecharge circuitry of the default column at position Y of the defaultdata set. When asserted, the BLPC_DFT[Y] signal directs the prechargecircuitry to precharge the bit lines of the default column, and whenunasserted, disables the precharge circuitry from precharging the bitlines.

The NOR gate 606 includes an input coupled to receive the PCHG_FLTsignal, an input to receive the inverted complement of the expansionmode signal 134 (EXP_MODE_B) and an output coupled to one input of theNAND gate 605. The other input of the NAND gate 605 is coupled toreceive the PCHG_EN signal and the output of the NAND gate 605 isconnected to the input of the inverter 603. The output of the inverter603 provides the BLPC enable signal 226. The operation of the NOR gate606, NAND gate 605, and inverter 603 is such that whenever the expansionmode is disabled (and thus EXP_MODE_B=1), the BPLC enable signal 226 isdeasserted, and thus disabling the precharge component 210.

FIG. 7 illustrates an example circuit implementation for the SAENcontrol component 130. In this embodiment, the SAEN control component130 includes an inverter 701 and a NAND gate 702. The NAND gate 702includes an input to receive an initial SAEN signal (“SAEN”), an inputto receive the expansion mode signal 134 (EXP_MODE), and an output toprovide an inverted complement of the SAEN enable signal 212(SAEN_EXP_B[K]) for the sense amplifier 208 of the expansion column 200at position X. The inverter 701 includes an input to receive the SAENsignal and an output to provide an inverted representation of the SAENsignal (SAEN_DFT_B[J]) to the sense amplifier associated with thedefault column at position Y. The operation of the NAND gate 702 is suchthat whenever the expansion mode is disabled (and thus EXP_MODE=0), thesignal SAEN_EXP_B[X] is asserted, and thus disabling the sense amplifier208 for the expansion column 200. Conversely, whenever the expansionmode is enabled (and thus EXP_MODE=0), the signal SAEN_EXP_B[X] is setto the inverted complement of the SAEN signal, and thus allowing thesense amplifier 208 to be enabled or disabled for read and writeoperations, respectively, in accordance with conventional memoryoperation.

FIG. 8 illustrates an example circuit implementation for a combinationof the write control component 214 and the write driver 202. In theillustrated example, the write control component 214 includes aninverter 801 and NOR gates 802, 803, and the write driver 202 includesdriver circuits 804, 806 to drive the bit line 116-1 (“WDT”) and thecomplement bit line 116-2 (“WDC”), respectively. The NOR gate 802includes an input to receive a write data bit (“WRDATA[ ]”) during awrite operation and an input to receive the inverted complement of theexpansion mode signal 134 (EXP_MODE_B). The output of the NOR gate 802is connected to the gates of the transistors 807, 808 of the drivercircuit 804. The inverter 801 includes an input to receive the writedata bit WRDATA[ ] and an output coupled to an input of the NOR gate803. The other input of the NOR gate 803 is connected to receive theinverted complement signal EXP_MODE_B. The output of the NOR gate 803 iscoupled to the gates of the transistors 809, 810 of the driver circuit806.

In operation, when the expansion mode is enabled (EXP_MODE_B=0), thecircuit implementing the write control component 214 operates to controlthe driver circuit 804 to output the value of WRDATA[ ] as the signalWDT and to control the driver circuit 806 to output the complement ofthe value of WRDATA[ ] as the signal WDC. However, when the expansionmode is disabled (EXP_MODE_B=1), the circuit implementing the writecontrol component 214 operates to control the driver circuit 804 and thedriver circuit 806 to drive opposite logic values regardless of thevalue of WRDATA[ ], and thus configure the bit lines of the bit linepair 116 to output the same opposite logic value pair while theexpansion data set 122 is disabled for use.

In some embodiments, the apparatus and techniques described above areimplemented in a system comprising one or more integrated circuit (IC)devices (also referred to as integrated circuit packages or microchips),such as the memory device described above with reference to FIGS. 1-8.Electronic design automation (EDA) and computer aided design (CAD)software tools may be used in the design and fabrication of these ICdevices. These design tools typically are represented as one or moresoftware programs. The one or more software programs comprise codeexecutable by a computer system to manipulate the computer system tooperate on code representative of circuitry of one or more IC devices soas to perform at least a portion of a process to design or adapt amanufacturing system to fabricate the circuitry. This code can includeinstructions, data, or a combination of instructions and data. Thesoftware instructions representing a design tool or fabrication tooltypically are stored in a non-transitory computer readable storagemedium accessible to the computing system. Likewise, the coderepresentative of one or more phases of the design or fabrication of anIC device may be stored in and accessed from the same computer readablestorage medium or a different computer readable storage medium.

A computer readable storage medium includes any non-transitory storagemedium, or combination of non-transitory storage media, accessible by acomputer system during use to provide instructions and/or data to thecomputer system. Such storage media can include, but is not limited to,optical media (e.g., compact disc (CD), digital versatile disc (DVD),Blu-Ray disc), magnetic media (e.g., floppy disc, magnetic tape, ormagnetic hard drive), volatile memory (e.g., random access memory (RAM)or cache), non-volatile memory (e.g., read-only memory (ROM) or Flashmemory), or microelectromechanical systems (MEMS)-based storage media.The computer readable storage medium may be embedded in the computingsystem (e.g., system RAM or ROM), fixedly attached to the computingsystem (e.g., a magnetic hard drive), removably attached to thecomputing system (e.g., an optical disc or Universal Serial Bus(USB)-based Flash memory), or coupled to the computer system via a wiredor wireless network (e.g., network accessible storage (NAS)).

Note that not all of the activities or elements described above in thegeneral description are required, that a portion of a specific activityor device may not be required, and that one or more further activitiesmay be performed, or elements included, in addition to those described.Still further, the order in which activities are listed are notnecessarily the order in which they are performed. Also, the conceptshave been described with reference to specific embodiments. However, oneof ordinary skill in the art appreciates that various modifications andchanges can be made without departing from the scope of the presentdisclosure as set forth in the claims below. Accordingly, thespecification and figures are to be regarded in an illustrative ratherthan a restrictive sense, and all such modifications are intended to beincluded within the scope of the present disclosure.

Benefits, other advantages, and solutions to problems have beendescribed above with regard to specific embodiments. However, thebenefits, advantages, solutions to problems, and any feature(s) that maycause any benefit, advantage, or solution to occur or become morepronounced are not to be construed as a critical, required, or essentialfeature of any or all the claims. Moreover, the particular embodimentsdisclosed above are illustrative only, as the disclosed subject mattermay be modified and practiced in different but equivalent mannersapparent to those skilled in the art having the benefit of the teachingsherein. No limitations are intended to the details of construction ordesign herein shown, other than as described in the claims below. It istherefore evident that the particular embodiments disclosed above may bealtered or modified and all such variations are considered within thescope of the disclosed subject matter. Accordingly, the protectionsought herein is as set forth in the claims below.

1-20. (canceled)
 21. A system comprising: a memory device employing anarray of bit cells including at least one default column of bit cellsand at least one expansion column of bit cells; an expansion controlcomponent associated with the memory device, the expansion controlcomponent comprising: a mode set component configured to provide anexpansion mode signal representing one of a non-expansion mode or anexpansion mode; and a plurality of sub-components configured to receivethe expansion mode signal and, in response to the expansion mode signalrepresenting the non-expansion mode, maintain the expansion column ofbit cells in a static state during access operations to the array or, inresponse to the expansion mode signal representing the expansion mode,operate both the default and expansion columns of bit cells.
 22. Thesystem of claim 21, wherein the plurality of sub-components includes awrite control component configured to drive a specified opposite logicvalue pair on bit lines of a bit line pair associated with the expansioncolumn responsive to the expansion mode signal representing thenon-expansion mode.
 23. The system of claim 22, wherein the plurality ofsub-components includes a bit line precharge (BLPC) control componentconfigured to receive the expansion mode signal and to disable aprecharge component from precharging the bit line pair associated withthe expansion column in response to the expansion mode signalrepresenting the non-expansion mode.
 24. The system of claim 23, whereinthe plurality of sub-components includes a sense amplifier enable (SAEN)control component configured to disable a sense amplifier associatedwith the expansion column in response to the expansion mode signalrepresenting the non-expansion mode.
 25. The system of claim 24, whereinthe sense amplifier is configured to sense voltages on the bit line pairassociated with the expansion column in response to a read operation.26. The system of claim 21, wherein the mode set component configuresthe expansion mode signal based on a state of at least one of: a signalon an external pin of a device implementing the memory device, a fuse ofa device implementing the memory device, and a programmable storagecomponent of a device implementing the memory device.
 27. The system ofclaim 21, wherein the bit cells of the array comprise static randomaccess memory (SRAM) bit cells.
 28. A system on a chip (SoC)implementing the system of claim 21, wherein the mode set component isconfigured to set the expansion mode signal based on a state of anexternal pin of the SoC.
 29. A method of operating a memory device, themethod comprising: responsive to the memory device being set to anexpansion mode, accessing each bit cell in a row for a plurality ofcolumns of an array of bit cells of the memory device during an accessoperation; and responsive to the memory device being set to anon-expansion mode, accessing each bit cell in a row for a first subsetof the plurality of columns of the array and maintaining the bit cellsin the row for columns of a second subset of the plurality of columns ina static state during an access operation.
 30. The method of claim 29,wherein maintaining the bit cells in the row for the columns of thesecond subset in a static state comprises: for each column of the secondsubset: configuring a write driver to drive a specified opposite logicvalue pair on bit lines of a bit line pair associated with the columnduring the access operation.
 31. The method of claim 30, whereinmaintaining the bit cells in the row for the columns of the secondsubset in a static state further comprises: for each column of thesecond subset: disabling a precharge circuit associated with the bitline pair.
 32. The method of claim 31, wherein maintaining the bit cellsin the row for the columns of the second subset in a static statefurther comprises: for each column of the second subset: disabling asense amplifier associated with the bit line pair.
 33. The method ofclaim 29, wherein maintaining the bit cells in the row for the columnsof the second subset in a static state comprises: for each column of thesecond subset: disabling a precharge circuit for a bit line pairassociated with the column.
 34. The method of claim 29, furthercomprising: setting the memory device to one of the expansion mode orthe non-expansion mode by determining a state of at least one of: asignal on an external pin of a device implementing the memory device, afuse of a device implementing the memory device, and a programmablestorage component of a device implementing the memory device.
 35. Themethod of claim 29, wherein the memory device comprises a static randomaccess memory (SRAM) device.
 36. A device comprising: a memorycomprising an array of rows of bit cells arranged into a default set ofcolumns and an expansion set of columns; a mode set component to providean expansion mode signal configurable to represent one of anon-expansion mode and an expansion mode; and an expansion controlcomponent configured to: responsive to the expansion mode signalrepresenting a non-expansion mode, maintaining the expansion set ofcolumns in a static state while dynamically operating the default set ofcolumns during an access operation for a row of the array; andresponsive to the expansion mode signal representing an expansion mode,dynamically operating both the default set and the expansion set ofcolumns during an access operation for a row of the array.
 37. Thedevice of claim 36, wherein the expansion control component comprises: awrite control component to configure a write driver to drive a specifiedopposite logic value pair on bit lines of a bit line pair associatedwith a select column responsive to the expansion mode signalrepresenting the non-expansion mode.
 38. The device of claim 37, furthercomprising: access components comprising a precharge circuit for the bitline pair; and wherein the expansion control component comprises a bitline precharge component to disable the precharge circuit responsive tothe expansion mode signal representing the non-expansion mode.
 39. Thedevice of claim 38, wherein the access components include a senseamplifier associated with the bit line pair.
 40. The device of claim 36,wherein the mode set component is configured to set the expansion modesignal based on a state of at least one of: a signal on an external pinof a device implementing the memory device, a fuse of a deviceimplementing the memory device, and a programmable storage component ofa device implementing the memory device.
 41. The device of claim 36,wherein the bit cells of the array comprise static random access memory(SRAM) bit cells.